The last barrier: On-chip antennas

Handle URI:
http://hdl.handle.net/10754/562582
Title:
The last barrier: On-chip antennas
Authors:
Cheema, Hammad; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
The last two decades have witnessed unprecedented development in the field of integrated circuits (ICs), driven by aggressive transistor scaling, unmatched levels of integration, advanced foundry processes, low cost, and improved yields. On one hand, digital integration, following the empirical prediction by Gordon Moore [1], has resulted in billions of transistors integrated in a few square millimeters, using processes that span the commercial range of 45 nm to 32 nm nodes [2] and transistors as small as 9 nm already demonstrated in research studies [3]. On the other hand, analog integration has also seen tremendous development (albeit at a relatively slower pace) resulting in highly integrated, multiband, multistandard transceivers for wireless communications [4][5]. © 2000-2012 IEEE.
KAUST Department:
Electrical Engineering Program; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Publisher:
Institute of Electrical and Electronics Engineers
Journal:
IEEE Microwave Magazine
Issue Date:
Jan-2013
DOI:
10.1109/MMM.2012.2226542
Type:
Article
ISSN:
15273342
Appears in Collections:
Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorCheema, Hammaden
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-08-03T10:43:39Zen
dc.date.available2015-08-03T10:43:39Zen
dc.date.issued2013-01en
dc.identifier.issn15273342en
dc.identifier.doi10.1109/MMM.2012.2226542en
dc.identifier.urihttp://hdl.handle.net/10754/562582en
dc.description.abstractThe last two decades have witnessed unprecedented development in the field of integrated circuits (ICs), driven by aggressive transistor scaling, unmatched levels of integration, advanced foundry processes, low cost, and improved yields. On one hand, digital integration, following the empirical prediction by Gordon Moore [1], has resulted in billions of transistors integrated in a few square millimeters, using processes that span the commercial range of 45 nm to 32 nm nodes [2] and transistors as small as 9 nm already demonstrated in research studies [3]. On the other hand, analog integration has also seen tremendous development (albeit at a relatively slower pace) resulting in highly integrated, multiband, multistandard transceivers for wireless communications [4][5]. © 2000-2012 IEEE.en
dc.publisherInstitute of Electrical and Electronics Engineersen
dc.titleThe last barrier: On-chip antennasen
dc.typeArticleen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journalIEEE Microwave Magazineen
kaust.authorCheema, Hammaden
kaust.authorShamim, Atifen
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