3D lumped components and miniaturized bandpass filter in an ultra-thin M-LCP for SOP applications

Handle URI:
http://hdl.handle.net/10754/562538
Title:
3D lumped components and miniaturized bandpass filter in an ultra-thin M-LCP for SOP applications
Authors:
Arabi, Eyad A. ( 0000-0003-2855-2061 ) ; Shamim, Atif ( 0000-0002-4207-4740 )
Abstract:
In this work, a library of 3D lumped components completely embedded in the thinnest, multilayer LCP (M-LCP) stack- up with four metallization layers and 100 μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional parallel plate capacitor. Based on the above mentioned library, a miniaturized bandpass filter is presented for the GPS application. It utilizes mutually coupled inductors and is the smallest reported in the literature with a size of (0.035×0.028×0.00089)λg. Finally, the same filter realized in a competing ceramic technology (LTCC) is compared in performance with the ultra-thin M-LCP design. The M-LCP module presented in this work is inherently exible and offers great potential for wearable and conformal applications.
KAUST Department:
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Electrical Engineering Program; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Publisher:
EMW Publishing
Journal:
Progress In Electromagnetics Research C
Issue Date:
2013
DOI:
10.2528/pierc13090903
Type:
Article
ISSN:
19378718
Appears in Collections:
Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorArabi, Eyad A.en
dc.contributor.authorShamim, Atifen
dc.date.accessioned2015-08-03T10:41:50Zen
dc.date.available2015-08-03T10:41:50Zen
dc.date.issued2013en
dc.identifier.issn19378718en
dc.identifier.doi10.2528/pierc13090903en
dc.identifier.urihttp://hdl.handle.net/10754/562538en
dc.description.abstractIn this work, a library of 3D lumped components completely embedded in the thinnest, multilayer LCP (M-LCP) stack- up with four metallization layers and 100 μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional parallel plate capacitor. Based on the above mentioned library, a miniaturized bandpass filter is presented for the GPS application. It utilizes mutually coupled inductors and is the smallest reported in the literature with a size of (0.035×0.028×0.00089)λg. Finally, the same filter realized in a competing ceramic technology (LTCC) is compared in performance with the ultra-thin M-LCP design. The M-LCP module presented in this work is inherently exible and offers great potential for wearable and conformal applications.en
dc.publisherEMW Publishingen
dc.title3D lumped components and miniaturized bandpass filter in an ultra-thin M-LCP for SOP applicationsen
dc.typeArticleen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journalProgress In Electromagnetics Research Cen
kaust.authorArabi, Eyad A.en
kaust.authorShamim, Atifen
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