Microencapsulation of silicon cavities using a pulsed excimer laser

Handle URI:
http://hdl.handle.net/10754/562217
Title:
Microencapsulation of silicon cavities using a pulsed excimer laser
Authors:
Sedky, Sherif M.; Tawfik, Hani H.; Ashour, Mohamed; Graham, Andrew B.; Provine, John W.; Wang, Qingxiao; Zhang, Xixiang ( 0000-0002-3478-6414 ) ; Howe, Roger T.
Abstract:
This work presents a novel low thermal-budget technique for sealing micromachined cavities in silicon. Cavities are sealed without deposition, similar to the silicon surface-migration sealing process. In contrast to the 1100°C furnace anneal required for the migration process, the proposed technique uses short excimer laser pulses (24ns), focused onto an area of 23mm 2, to locally heat the top few microns of the substrate, while the bulk substrate remains near ambient temperature. The treatment can be applied to selected regions of the substrate, without the need for special surface treatments or a controlled environment. This work investigates the effect of varying the laser pulse energy from 400 mJ cm 2to 800 mJ cm 2, the pulse rate from 1Hz to 50Hz and the pulse count from 200 to 3000 pulses on sealing microfabricated cavities in silicon. An analytical model for the effect of holes on the surface temperature distribution is derived, which shows that much higher temperatures can be achieved by increasing the hole density. A mechanism for sealing the cavities is proposed, which indicates how complete sealing is feasible. © 2012 IOP Publishing Ltd.
KAUST Department:
Advanced Nanofabrication, Imaging and Characterization Core Lab; Physical Sciences and Engineering (PSE) Division; Materials Science and Engineering Program; Core Labs
Publisher:
IOP Publishing
Journal:
Journal of Micromechanics and Microengineering
Issue Date:
7-Jun-2012
DOI:
10.1088/0960-1317/22/7/075012
Type:
Article
ISSN:
09601317
Appears in Collections:
Articles; Advanced Nanofabrication, Imaging and Characterization Core Lab; Physical Sciences and Engineering (PSE) Division; Materials Science and Engineering Program

Full metadata record

DC FieldValue Language
dc.contributor.authorSedky, Sherif M.en
dc.contributor.authorTawfik, Hani H.en
dc.contributor.authorAshour, Mohameden
dc.contributor.authorGraham, Andrew B.en
dc.contributor.authorProvine, John W.en
dc.contributor.authorWang, Qingxiaoen
dc.contributor.authorZhang, Xixiangen
dc.contributor.authorHowe, Roger T.en
dc.date.accessioned2015-08-03T09:56:43Zen
dc.date.available2015-08-03T09:56:43Zen
dc.date.issued2012-06-07en
dc.identifier.issn09601317en
dc.identifier.doi10.1088/0960-1317/22/7/075012en
dc.identifier.urihttp://hdl.handle.net/10754/562217en
dc.description.abstractThis work presents a novel low thermal-budget technique for sealing micromachined cavities in silicon. Cavities are sealed without deposition, similar to the silicon surface-migration sealing process. In contrast to the 1100°C furnace anneal required for the migration process, the proposed technique uses short excimer laser pulses (24ns), focused onto an area of 23mm 2, to locally heat the top few microns of the substrate, while the bulk substrate remains near ambient temperature. The treatment can be applied to selected regions of the substrate, without the need for special surface treatments or a controlled environment. This work investigates the effect of varying the laser pulse energy from 400 mJ cm 2to 800 mJ cm 2, the pulse rate from 1Hz to 50Hz and the pulse count from 200 to 3000 pulses on sealing microfabricated cavities in silicon. An analytical model for the effect of holes on the surface temperature distribution is derived, which shows that much higher temperatures can be achieved by increasing the hole density. A mechanism for sealing the cavities is proposed, which indicates how complete sealing is feasible. © 2012 IOP Publishing Ltd.en
dc.publisherIOP Publishingen
dc.titleMicroencapsulation of silicon cavities using a pulsed excimer laseren
dc.typeArticleen
dc.contributor.departmentAdvanced Nanofabrication, Imaging and Characterization Core Laben
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentMaterials Science and Engineering Programen
dc.contributor.departmentCore Labsen
dc.identifier.journalJournal of Micromechanics and Microengineeringen
dc.contributor.institutionAmerican University in Cairo, School of Sciences and Engineering, Physics Department, New Cairo, Egypten
dc.contributor.institutionStanford University, CA, United Statesen
dc.contributor.institutionZewail City of Science and Technology, Giza, Egypten
kaust.authorWang, Qingxiaoen
kaust.authorZhang, Xixiangen
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