5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

Handle URI:
http://hdl.handle.net/10754/561969
Title:
5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications
Authors:
Shamim, Atif ( 0000-0002-4207-4740 ) ; Arsalan, Muhammad; Hojjat, Nasrin; Roy, Langis
Abstract:
A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.
KAUST Department:
Electrical Engineering Program; Physical Sciences and Engineering (PSE) Division; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Publisher:
EMW Publishing
Journal:
Progress In Electromagnetics Research C
Issue Date:
2012
DOI:
10.2528/PIERC11092004
Type:
Article
ISSN:
19378718
Appears in Collections:
Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Physical Sciences and Engineering (PSE) Division; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorShamim, Atifen
dc.contributor.authorArsalan, Muhammaden
dc.contributor.authorHojjat, Nasrinen
dc.contributor.authorRoy, Langisen
dc.date.accessioned2015-08-03T09:35:17Zen
dc.date.available2015-08-03T09:35:17Zen
dc.date.issued2012en
dc.identifier.issn19378718en
dc.identifier.doi10.2528/PIERC11092004en
dc.identifier.urihttp://hdl.handle.net/10754/561969en
dc.description.abstractA novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.en
dc.publisherEMW Publishingen
dc.title5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applicationsen
dc.typeArticleen
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Laben
dc.identifier.journalProgress In Electromagnetics Research Cen
dc.contributor.institutionTenXc Wireless Inc, Ottawa, ON K2K 2X1, Canadaen
dc.contributor.institutionDepartment of Electronics, Carleton University, Ottawa, ON K1S 5B6, Canadaen
kaust.authorShamim, Atifen
kaust.authorArsalan, Muhammaden
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