Low-cost silicon wafer dicing using a craft cutter

Handle URI:
http://hdl.handle.net/10754/556898
Title:
Low-cost silicon wafer dicing using a craft cutter
Authors:
Fan, Yiqiang; Carreno, Armando Arpys Arevalo ( 0000-0001-9446-3310 ) ; Li, Huawei; Foulds, Ian G.
Abstract:
This paper reports a low-cost silicon wafer dicing technique using a commercial craft cutter. The 4-inch silicon wafers were scribed using a crafter cutter with a mounted diamond blade. The pre-programmed automated process can reach a minimum die feature of 3 mm by 3 mm. We performed this scribing process on the top polished surface of a silicon wafer; we also created a scribing method for the back-unpolished surface in order to protect the structures on the wafer during scribing. Compared with other wafer dicing methods, our proposed dicing technique is extremely low cost (lower than $1,000), and suitable for silicon wafer dicing in microelectromechanical or microfluidic fields, which usually have a relatively large die dimension. The proposed dicing technique is also usable for dicing multiple project wafers, a process where dies of different dimensions are diced on the same wafer.
KAUST Department:
Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe); Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Citation:
Low-cost silicon wafer dicing using a craft cutter 2014, 21 (7):1411 Microsystem Technologies
Publisher:
Springer Science + Business Media
Journal:
Microsystem Technologies
Issue Date:
20-May-2014
DOI:
10.1007/s00542-014-2198-4
Type:
Article
ISSN:
0946-7076; 1432-1858
Additional Links:
http://link.springer.com/10.1007/s00542-014-2198-4
Appears in Collections:
Articles; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorFan, Yiqiangen
dc.contributor.authorCarreno, Armando Arpys Arevaloen
dc.contributor.authorLi, Huaweien
dc.contributor.authorFoulds, Ian G.en
dc.date.accessioned2015-06-14T13:14:57Zen
dc.date.available2015-06-14T13:14:57Zen
dc.date.issued2014-05-20en
dc.identifier.citationLow-cost silicon wafer dicing using a craft cutter 2014, 21 (7):1411 Microsystem Technologiesen
dc.identifier.issn0946-7076en
dc.identifier.issn1432-1858en
dc.identifier.doi10.1007/s00542-014-2198-4en
dc.identifier.urihttp://hdl.handle.net/10754/556898en
dc.description.abstractThis paper reports a low-cost silicon wafer dicing technique using a commercial craft cutter. The 4-inch silicon wafers were scribed using a crafter cutter with a mounted diamond blade. The pre-programmed automated process can reach a minimum die feature of 3 mm by 3 mm. We performed this scribing process on the top polished surface of a silicon wafer; we also created a scribing method for the back-unpolished surface in order to protect the structures on the wafer during scribing. Compared with other wafer dicing methods, our proposed dicing technique is extremely low cost (lower than $1,000), and suitable for silicon wafer dicing in microelectromechanical or microfluidic fields, which usually have a relatively large die dimension. The proposed dicing technique is also usable for dicing multiple project wafers, a process where dies of different dimensions are diced on the same wafer.en
dc.publisherSpringer Science + Business Mediaen
dc.relation.urlhttp://link.springer.com/10.1007/s00542-014-2198-4en
dc.rightsArchived with thanks to Microsystem Technologies. © The Author(s) 2014. This article is published with open access at Springerlink.comen
dc.titleLow-cost silicon wafer dicing using a craft cutteren
dc.typeArticleen
dc.contributor.departmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)en
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journalMicrosystem Technologiesen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionSchool of Engineering, Okanagan Campus, The University of British Columbia, Vancouver, Canadaen
kaust.authorFan, Yiqiangen
kaust.authorLi, Huaweien
kaust.authorCarreno, Armando Arpys Arevaloen
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