Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)

Handle URI:
http://hdl.handle.net/10754/555742
Title:
Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)
Authors:
Hussain, Muhammad Mustafa ( 0000-0003-3279-0441 ) ; Rojas, Jhonathan Prieto ( 0000-0001-7848-1121 ) ; Sevilla, Galo T. ( 0000-0002-9419-4437 )
Abstract:
Today’s information age is driven by silicon based electronics. For nearly four decades semiconductor industry has perfected the fabrication process of continuingly scaled transistor – heart of modern day electronics. In future, silicon industry will be more pervasive, whose application will range from ultra-mobile computation to bio-integrated medical electronics. Emergence of flexible electronics opens up interesting opportunities to expand the horizon of electronics industry. However, silicon – industry’s darling material is rigid and brittle. Therefore, we report a generic batch fabrication process to convert nearly any silicon electronics into a flexible one without compromising its (i) performance; (ii) ultra-large-scale-integration complexity to integrate billions of transistors within small areas; (iii) state-of-the-art process compatibility, (iv) advanced materials used in modern semiconductor technology; (v) the most widely used and well-studied low-cost substrate mono-crystalline bulk silicon (100). In our process, we make trenches using anisotropic reactive ion etching (RIE) in the inactive areas (in between the devices) of a silicon substrate (after the devices have been fabricated following the regular CMOS process), followed by a dielectric based spacer formation to protect the sidewall of the trench and then performing an isotropic etch to create caves in silicon. When these caves meet with each other the top portion of the silicon with the devices is ready to be peeled off from the bottom silicon substrate. Release process does not need to use any external support. Released silicon fabric (25 μm thick) is mechanically flexible (5 mm bending radius) and the trenches make it semi-transparent (transparency of 7%). © (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
KAUST Department:
Integrated Nanotechnology Lab; Electrical Engineering Program; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Citation:
Hussain, Muhammad M., Jhonathan P. Rojas, and Galo A. Torres Sevilla. "Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)." In SPIE Defense, Security, and Sensing, pp. 87251M-87251M. International Society for Optics and Photonics, 2013
Publisher:
SPIE-Intl Soc Optical Eng
Journal:
Micro- and Nanotechnology Sensors, Systems, and Applications V
Conference/Event name:
2013 Micro- and Nanotechnology Sensors, Systems, and Applications V Conference
Issue Date:
30-May-2013
DOI:
10.1117/12.2015551
Type:
Conference Paper
Additional Links:
http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=10.1117/12.2015551
Appears in Collections:
Conference Papers; Electrical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division; Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorHussain, Muhammad Mustafaen
dc.contributor.authorRojas, Jhonathan Prietoen
dc.contributor.authorSevilla, Galo T.en
dc.date.accessioned2015-05-26T06:57:52Zen
dc.date.available2015-05-26T06:57:52Zen
dc.date.issued2013-05-30en
dc.identifier.citationHussain, Muhammad M., Jhonathan P. Rojas, and Galo A. Torres Sevilla. "Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)." In SPIE Defense, Security, and Sensing, pp. 87251M-87251M. International Society for Optics and Photonics, 2013en
dc.identifier.doi10.1117/12.2015551en
dc.identifier.urihttp://hdl.handle.net/10754/555742en
dc.description.abstractToday’s information age is driven by silicon based electronics. For nearly four decades semiconductor industry has perfected the fabrication process of continuingly scaled transistor – heart of modern day electronics. In future, silicon industry will be more pervasive, whose application will range from ultra-mobile computation to bio-integrated medical electronics. Emergence of flexible electronics opens up interesting opportunities to expand the horizon of electronics industry. However, silicon – industry’s darling material is rigid and brittle. Therefore, we report a generic batch fabrication process to convert nearly any silicon electronics into a flexible one without compromising its (i) performance; (ii) ultra-large-scale-integration complexity to integrate billions of transistors within small areas; (iii) state-of-the-art process compatibility, (iv) advanced materials used in modern semiconductor technology; (v) the most widely used and well-studied low-cost substrate mono-crystalline bulk silicon (100). In our process, we make trenches using anisotropic reactive ion etching (RIE) in the inactive areas (in between the devices) of a silicon substrate (after the devices have been fabricated following the regular CMOS process), followed by a dielectric based spacer formation to protect the sidewall of the trench and then performing an isotropic etch to create caves in silicon. When these caves meet with each other the top portion of the silicon with the devices is ready to be peeled off from the bottom silicon substrate. Release process does not need to use any external support. Released silicon fabric (25 μm thick) is mechanically flexible (5 mm bending radius) and the trenches make it semi-transparent (transparency of 7%). © (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.en
dc.publisherSPIE-Intl Soc Optical Engen
dc.relation.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=10.1117/12.2015551en
dc.rightsArchived with thanks to Proceedings of SPIEen
dc.titleMechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)en
dc.typeConference Paperen
dc.contributor.departmentIntegrated Nanotechnology Laben
dc.contributor.departmentElectrical Engineering Programen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Divisionen
dc.identifier.journalMicro- and Nanotechnology Sensors, Systems, and Applications Ven
dc.conference.date2013-04-29 to 2013-05-03en
dc.conference.name2013 Micro- and Nanotechnology Sensors, Systems, and Applications V Conferenceen
dc.conference.locationBaltimore, MD, USAen
dc.eprint.versionPublisher's Version/PDFen
kaust.authorHussain, Muhammad Mustafaen
kaust.authorRojas, Jhonathan Prietoen
kaust.authorSevilla, Galo T.en
All Items in KAUST are protected by copyright, with all rights reserved, unless otherwise indicated.