Stick-slip substructure in rapid tape peeling

Handle URI:
http://hdl.handle.net/10754/554107
Title:
Stick-slip substructure in rapid tape peeling
Authors:
Thoroddsen, Sigurdur T. ( 0000-0001-6997-4311 ) ; Nguyen, H. D.; Takehara, K.; Etoh, T. G.
Abstract:
The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
KAUST Department:
Physical Sciences and Engineering (PSE) Division
Citation:
Stick-slip substructure in rapid tape peeling 2010, 82 (4) Physical Review E
Publisher:
American Physical Society (APS)
Journal:
Physical Review E
Issue Date:
15-Oct-2010
DOI:
10.1103/PhysRevE.82.046107
Type:
Article
ISSN:
1539-3755; 1550-2376
Additional Links:
http://link.aps.org/doi/10.1103/PhysRevE.82.046107
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Physical Sciences and Engineering (PSE) Division

Full metadata record

DC FieldValue Language
dc.contributor.authorThoroddsen, Sigurdur T.en
dc.contributor.authorNguyen, H. D.en
dc.contributor.authorTakehara, K.en
dc.contributor.authorEtoh, T. G.en
dc.date.accessioned2015-05-18T21:55:36Zen
dc.date.available2015-05-18T21:55:36Zen
dc.date.issued2010-10-15en
dc.identifier.citationStick-slip substructure in rapid tape peeling 2010, 82 (4) Physical Review Een
dc.identifier.issn1539-3755en
dc.identifier.issn1550-2376en
dc.identifier.doi10.1103/PhysRevE.82.046107en
dc.identifier.urihttp://hdl.handle.net/10754/554107en
dc.description.abstractThe peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.en
dc.publisherAmerican Physical Society (APS)en
dc.relation.urlhttp://link.aps.org/doi/10.1103/PhysRevE.82.046107en
dc.rightsArchived with thanks to Physical Review Een
dc.titleStick-slip substructure in rapid tape peelingen
dc.typeArticleen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.identifier.journalPhysical Review Een
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionCivil and Environmental Engineering, Kinki University, Higashi-Osaka 577-8502, Japanen
kaust.authorThoroddsen, Sigurdur T.en
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