The influence of Ni additions on the relative stability of η and η′ Cu6Sn5

Handle URI:
http://hdl.handle.net/10754/315738
Title:
The influence of Ni additions on the relative stability of η and η′ Cu6Sn5
Authors:
Schwingenschlögl, Udo ( 0000-0003-4179-7231 ) ; Di Paola, Cono; Gourlay, C. M.; Nogita, K.
Abstract:
We investigate how 5 at. % Ni influences the relative stability of η and η′ Cu6Sn5. Synchrotron x-ray diffraction shows that, while Cu6Sn5 exists as η′ at 25 and 150 °C and transforms to η on heating to 200 °C, Cu5.5Ni0.5Sn5 is best fit to η throughout 25–200 °C. Our first principles calculations predict that η′ is stable at T=0 K in both Cu6Sn5 and Cu5.5Ni0.5Sn5, but that the energy difference is substantially reduced from 1.21 to 0.90 eV per 22 atom cell by the Ni addition. This effect is attributed to Ni developing distinct bonding to both Cu and Sn in the η phase.
KAUST Department:
Physical Sciences and Engineering (PSE) Division; Computational Physics and Materials Science (CPMS)
Citation:
Schwingenschlögl U, Di Paola C, Nogita K, Gourlay CM (2010) The influence of Ni additions on the relative stability of - and -[sup -] Cu[sub 6]Sn[sub 5]. Appl Phys Lett 96: 061908. doi:10.1063/1.3310019.
Publisher:
AIP Publishing
Journal:
Applied Physics Letters
Issue Date:
9-Feb-2010
DOI:
10.1063/1.3310019
Type:
Article
ISSN:
00036951
Additional Links:
http://scitation.aip.org/content/aip/journal/apl/96/6/10.1063/1.3310019
Appears in Collections:
Articles; Physical Sciences and Engineering (PSE) Division; Computational Physics and Materials Science (CPMS)

Full metadata record

DC FieldValue Language
dc.contributor.authorSchwingenschlögl, Udoen
dc.contributor.authorDi Paola, Conoen
dc.contributor.authorGourlay, C. M.en
dc.contributor.authorNogita, K.en
dc.date.accessioned2014-04-13T12:15:12Z-
dc.date.available2014-04-13T12:15:12Z-
dc.date.issued2010-02-09en
dc.identifier.citationSchwingenschlögl U, Di Paola C, Nogita K, Gourlay CM (2010) The influence of Ni additions on the relative stability of - and -[sup -] Cu[sub 6]Sn[sub 5]. Appl Phys Lett 96: 061908. doi:10.1063/1.3310019.en
dc.identifier.issn00036951en
dc.identifier.doi10.1063/1.3310019en
dc.identifier.urihttp://hdl.handle.net/10754/315738en
dc.description.abstractWe investigate how 5 at. % Ni influences the relative stability of η and η′ Cu6Sn5. Synchrotron x-ray diffraction shows that, while Cu6Sn5 exists as η′ at 25 and 150 °C and transforms to η on heating to 200 °C, Cu5.5Ni0.5Sn5 is best fit to η throughout 25–200 °C. Our first principles calculations predict that η′ is stable at T=0 K in both Cu6Sn5 and Cu5.5Ni0.5Sn5, but that the energy difference is substantially reduced from 1.21 to 0.90 eV per 22 atom cell by the Ni addition. This effect is attributed to Ni developing distinct bonding to both Cu and Sn in the η phase.en
dc.language.isoenen
dc.publisherAIP Publishingen
dc.relation.urlhttp://scitation.aip.org/content/aip/journal/apl/96/6/10.1063/1.3310019en
dc.rightsArchived with thanks to Applied Physics Lettersen
dc.titleThe influence of Ni additions on the relative stability of η and η′ Cu6Sn5en
dc.typeArticleen
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Divisionen
dc.contributor.departmentComputational Physics and Materials Science (CPMS)en
dc.identifier.journalApplied Physics Lettersen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionSchool of Mechanical and Mining Engineering, University of Queensland, Brisbane 4072, Australiaen
dc.contributor.institutionDepartment of Materials, Imperial College, London SW7 2AZ, United Kingdomen
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)en
kaust.authorSchwingenschlögl, Udoen
kaust.authorDi Paola, Conoen
All Items in KAUST are protected by copyright, with all rights reserved, unless otherwise indicated.