Wax-bonding 3D microfluidic chips

Handle URI:
http://hdl.handle.net/10754/303150
Title:
Wax-bonding 3D microfluidic chips
Authors:
Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas ( 0000-0001-9417-8894 ) ; Qin, Jianhua; Wen, Weijia
Abstract:
We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
KAUST Department:
Computational Bioscience Research Center (CBRC)
Citation:
Gong X, Yi X, Xiao K, Li S, Kodzius R, et al. (2010) Wax-bonding 3D microfluidic chips. Lab Chip 10: 2622. doi:10.1039/c004744a.
Publisher:
Royal Society of Chemistry (RSC)
Journal:
Lab on a Chip
Issue Date:
10-Oct-2013
DOI:
10.1039/c004744a
Type:
Article
ISSN:
1473-0197; 1473-0189
Sponsors:
Award No. SA-C0040/UK-C0016, made by King Abdullah University of Science and Technology (KAUST); Hong Kong RGC grants HKUST 603608; Nanoscience and Nanotechnology Program at HKUST
Additional Links:
http://xlink.rsc.org/?DOI=c004744a; http://pubs.rsc.org/en/content/articlepdf/2010/LC/C004744A; http://xlink.rsc.org/?DOI=c004744a
Appears in Collections:
Articles; Computational Bioscience Research Center (CBRC)

Full metadata record

DC FieldValue Language
dc.contributor.authorGong, Xiuqingen
dc.contributor.authorYi, Xinen
dc.contributor.authorXiao, Kangen
dc.contributor.authorLi, Shunboen
dc.contributor.authorKodzius, Rimantasen
dc.contributor.authorQin, Jianhuaen
dc.contributor.authorWen, Weijiaen
dc.date.accessioned2013-10-10T07:56:57Z-
dc.date.available2013-10-10T07:56:57Z-
dc.date.issued2013-10-10en
dc.identifier.citationGong X, Yi X, Xiao K, Li S, Kodzius R, et al. (2010) Wax-bonding 3D microfluidic chips. Lab Chip 10: 2622. doi:10.1039/c004744a.en
dc.identifier.issn1473-0197en
dc.identifier.issn1473-0189en
dc.identifier.doi10.1039/c004744aen
dc.identifier.urihttp://hdl.handle.net/10754/303150en
dc.description.abstractWe report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.en
dc.description.sponsorshipAward No. SA-C0040/UK-C0016, made by King Abdullah University of Science and Technology (KAUST); Hong Kong RGC grants HKUST 603608; Nanoscience and Nanotechnology Program at HKUSTen
dc.language.isoenen
dc.publisherRoyal Society of Chemistry (RSC)en
dc.relation.urlhttp://xlink.rsc.org/?DOI=c004744aen
dc.relation.urlhttp://pubs.rsc.org/en/content/articlepdf/2010/LC/C004744Aen
dc.relation.urlhttp://xlink.rsc.org/?DOI=c004744aen
dc.rightsArchived with thanks to Lab on a Chipen
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/en
dc.subjectMicrofluidicen
dc.subjectBacteriaen
dc.subjectBiocompatibilityen
dc.subjectChipen
dc.titleWax-bonding 3D microfluidic chipsen
dc.typeArticleen
dc.contributor.departmentComputational Bioscience Research Center (CBRC)en
dc.identifier.journalLab on a Chipen
dc.eprint.versionPublisher's Version/PDFen
dc.contributor.institutionThe Hong Kong University of Science and Technology (HKUST)en
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)en
kaust.authorKodzius, Rimantasen
kaust.authorWen, Weijiaen
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